Telecommunications

Patent Issued for Headset Antenna and Connector for the Same

  2012 AUG 22 (VerticalNews) -- By a News Reporter-Staff News Editor at Telecommunications Weekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventor Hung, Chung-Ting (Taoyuan County, TW), filed on February 24, 2008, was cleared and issued on August 7, 2012.

  The assignee for this patent, patent number 8237623, is HTC Corporation (Taoyuan County, TW).

  Reporters obtained the following quote from the background information supplied by the inventors: "The present invention generally relates to a circuit structural design for an antenna, and more particularly to a circuit structural design for a headset antenna.

  "Headset antennas are widely used in mobile broadcast, especially in receiving operation of frequency modulation (FM) broadcast. Currently, headset antennas are also employed in mobile television field for improving signal receiving efficiency thereof.

  "In a typical headset antenna, an audio signal line and an antenna are often integrated in a headset wire. Therefore, signals received by the antenna attenuate due to a coupling effect of adjacent lines. That is so because, the audio signal line is equal to a ground at the specified frequency band of the RF (Radio frequency) signal, so that receiving capability of the antenna is weakened due to the adjacent audio signal lines. This is also a main factor restricting the receiving capability of the current conventional headset antennas. However, most current headset antennas are designed to improve the receiving capability by employing post power amplifiers, instead of providing a corresponding solution."

  In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventor's summary information for this patent: "Accordingly, the present invention is directed to a mobile phone antenna, in which a high impedance element is disposed on a transmission path of an audio signal. The high impedance element is adapted to selectively increase equivalent impedance at a specified frequency band of the antenna. Therefore, the audio signal lines are equal to an open circuit at the specified frequency band of RF signals received by the antenna, and receiving capability of the antenna is improved.

  "The present invention provides a connector for an electronic device. There is a high impedance element disposed at a transmitting pin of audio signals so as to avoid a loss of the receiving capability of the antenna caused by circuit coupling.

  "The present invention provides a headset antenna. The headset antenna includes at least an audio signal line, an antenna and at least one high impedance element. The audio signal line is adapted for transmitting an audio signal. The antenna is disposed adjacent to the audio signal line and is adapted for receiving an RF signal. The high impedance element is correspondingly disposed on a transmission path of the audio signal line. The audio signal and the RF signal are transmitted at different specified frequency bands, and equivalent impedance generated by the high impedance element at the specified frequency band of the RF signal is greater than that generated at specified frequency band of the audio signal.

  "According to an embodiment of the present invention, the foregoing headset antenna further includes a connector. The connector includes an audio pin, an antenna pin. The audio pin is coupled with the audio signal line and the antenna pin is coupled with the antenna, wherein the high impedance element integrated on a board of the connector.

  "According to an embodiment of the present invention, the foregoing specified frequency band of the RF signal includes a frequency modulation broadcast band, i.e., 87 MHz to 108 MHz.

  "According to an embodiment of the present invention, the foregoing specified frequency band of the RF signal includes a band from 300 MHz to 3 GHz.

  "According to an embodiment of the present invention, the foregoing specified frequency band of the audio signal includes a band from 20 Hz to 20 KHz.

  "According to an embodiment of the present invention, the foregoing audio signal lines include a right sound channel signal line, a left sound channel signal line, and a microphone audio signal line.

  "According to an embodiment of the present invention, the foregoing headset antenna further includes a ground line for applying a ground level to the audio signal and there is a high impedance element disposed on a transmission path of the ground line.

  "According to an embodiment of the present invention, the foregoing high impedance element is a magnetic bead, an electrical inductor, an iron core, or a resistor.

  "According to an embodiment of the present invention, the headset antenna further comprises a plurality of data signal lines for transmitting a plurality of data signals and a plurality of second high impedance elements are respectively disposed on transmission paths of the data signal lines.

  "The present invention further provides an electronic device connector adapted for a headset antenna. The connector includes an audio pin, an antenna pin and a high impedance element. The audio pin is used for transmitting the audio signal to the headset. The antenna pin is used for receiving an RF signal received from the headset antenna. The high impedance element is disposed at a rear of the audio pin.

  "The present invention disposes a high impedance element on a transmission path of an audio signal, an impedance of the high impedance element varying corresponding to the frequency. In such a way, the high impedance element is capable of selectively generating a greater equivalent impedance in the specified frequency band of an RF signal received by the antenna. As such, the audio line is regarded as an open circuit at the specified frequency band of the RF signal and as a short circuit at the specified frequency band of the audio signal, so that the audio signal can be well transmitted thereby. When the antenna receives an RF signal, the high impedance element that is equivalent to a high impedance element is capable of decreasing the coupling between the RF signal and the adjacent audio signal line, so as to improve the receiving capability of the antenna."

  For more information, see this patent: Hung, Chung-Ting. Headset Antenna and Connector for the Same. U.S. Patent Number 8237623, filed February 24, 2008, and issued August 7, 2012. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=56&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2782&f=G&l=50&co1=AND&d=PTXT&s1=20120807.PD.&OS=ISD/20120807&RS=ISD/20120807

  Keywords for this news article include: HTC Corporation.

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